MECHANIC Solder paste 35g XG50 183c
Description
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High-Quality Solder Paste: Formulated with a precise mixture of alloy and flux for consistent performance.
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Alloy Composition: Contains 63% tin (Sn) and 37% lead (Pb), ideal for general soldering applications.
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Melting Point: 183°C (361.4°F), suitable for standard electronic soldering tasks.
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Package Size: Comes in a 35g container, convenient for both small and large-scale projects.
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Fine Particle Size: Ensures smooth application, reducing bridging and solder ball defects.
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Excellent Flux Activity: Provides good wetting properties, ensuring strong and reliable joints.
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Stable and Long-Lasting: Maintains its consistency even during extended storage.
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Versatile Use: Ideal for soldering PCBs, BGA reballing, and SMD components.
Brand Reliability: Manufactured by MECHANIC, known for high-quality soldering products.
Package Include:
1x Solder Paste
