The 400 Tie Points Half Size Solderless Breadboard is a versatile and user-friendly tool for prototyping and testing your electronic circuits. This high-quality breadboard offers a secure and efficient platform for connecting components without the need for soldering.

Key Features:

• Versatile Design: 400 Tie Points Accommodates a wide range of components and circuits.
• Solderless Connection: Easily connect and disconnect components without soldering.
• Power Lanes: Provides dedicated power supply connections for convenience.
• Durable Construction: Built to last with high-quality materials.
• Compact Size: Ideal for various projects and workspace setups.

Specifications:

• Tie Points: 400
• Power Lanes: 100
• Dimensions: 82mm x 55mm x 10mm
• Maximum Voltage: 300V
• Maximum Operating Current: 3-5A
• Allowed Wire Size: 29-20 AWG

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Streamline your prototyping process with our 400 Tie Points Half Size Solderless Breadboard. Experience the versatility and convenience of this essential tool.