Small heat sink for TO-3. Diamond Basket 5750 is a series of diamond shaped basket board level heat sinks designed to cool TO‐3 devices. These black anodized heatsinks are perfect for cooling off components, IC or etc.
Specification:
- Size: 41.40x32.7x25 (in mm)
- Material: Aluminum
- Surface: Black Anodized
- Suitable for: TO-3 and RD-91 package components
Package Includes:
1 x Aluminum Heatsink TO-3 Package for Transistor
