The 400 Tie Points Half Size Solderless Breadboard is a versatile and user-friendly tool for prototyping and testing your electronic circuits. This high-quality breadboard offers a secure and efficient platform for connecting components without the need for soldering.
Key Features:
- Versatile Design: 400 Tie Points Accommodates a wide range of components and circuits.
- Solderless Connection: Easily connect and disconnect components without soldering.
- Power Lanes: Provides dedicated power supply connections for convenience.
- Durable Construction: Built to last with high-quality materials.
- Compact Size: Ideal for various projects and workspace setups.
Specifications:
- Tie Points: 400
- Power Lanes: 100
- Dimensions: 82mm x 55mm x 10mm
- Maximum Voltage: 300V
- Maximum Operating Current: 3-5A
- Allowed Wire Size: 29-20 AWG
Order Now:
Streamline your prototyping process with our 400 Tie Points Half Size Solderless Breadboard. Experience the versatility and convenience of this essential tool.